MC33FS6500CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6500CAE Overview
It is acceptable to ship using the method Tray .The package is conveniently packaged the power management in 48-LQFP Exposed Pad .An easy-to-adapt universal mounting system is provided by Surface Mount .At System Basis Chip and other applications, this power management is targeted.It is recommended that you set the operating temperature of the power management ic to -40°C~125°C in order to prevent malfunctions.The power management works at 1V~5V voltage.
MC33FS6500CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6500CAE Applications
There are a lot of NXP USA Inc. MC33FS6500CAEPower Management applications.
- Termination Voltage
- DSP
- Automotive Infotainment
- DDR-II Termination Voltage
- Networking Equipment
- System Thermal for PCs
- Projection Mapping
- Telecom Rectifiers
- Cluster
- GPS
