MC33FS6500LAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6500LAE Overview
The way of Tray is acceptable for shipping the power management.The package is conveniently packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method allows for easy adaptation.The power management is designed for use with applications at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.The power management works at 1V~5V voltage.
MC33FS6500LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6500LAE Applications
There are a lot of NXP USA Inc. MC33FS6500LAEPower Management applications.
- Tablet PCs
- LP2996A: DDR3
- Data Storage
- SSTL-3
- Automotive Infotainment
- Docking station
- Equipment Run-Off of Battery Backup
- Telecommunication
- Industrial applications
- Networking Router
