MC33FS6500LAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6500LAER2 Overview
Shipments can be made in the direction of Tape & Reel (TR) .The package is conveniently packaged the power management in 48-LQFP Exposed Pad .An easy-to-adapt universal mounting system is provided by Surface Mount .There are a number of applications targeted at System Basis Chip .Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.For its operation, the power management uses 1V~5V voltage.
MC33FS6500LAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6500LAER2 Applications
There are a lot of NXP USA Inc. MC33FS6500LAER2Power Management applications.
- Automotive head unit
- SmartPhones
- LP2996-N: DDR1 Termination Voltage
- DDR-II Termination Voltage
- Surround view system ECU
- Automotive camera module
- Chromebook
- Hardware Monitoring for Servers
- SSTL-3
- Medical
