MC33FS6500NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6500NAE Overview
It is acceptable to ship using the method Tray .Packing in 48-LQFP Exposed Pad makes transportation convenient.For easy adaptability, Surface Mount provides a universal mounting method.The power management is intended for use at System Basis Chip as well as other applications.Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.The power management works at 1V~5V voltage.
MC33FS6500NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6500NAE Applications
There are a lot of NXP USA Inc. MC33FS6500NAEPower Management applications.
- Optical imaging payload
- Automotive Infotainment
- Digital Signage
- DDR-II Termination Voltage
- DDR Termination Voltage WHITE SPACE
- DDR2 Termination Voltage
- Applications Processors
- System Thermal for Servers
- Servers
- I/Os (FPGAs, ASICs, DSPs)
