MC33FS6500NAER2
| Parameters | |
|---|---|
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
MC33FS6500NAER2 Overview
It is acceptable to ship using the method Tape & Reel (TR) .packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.An easy-to-adapt universal mounting system is provided by Surface Mount .It targets applications such as System Basis Chip and others.Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.For its operation, the power management uses 1V~5V voltage.
MC33FS6500NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6500NAER2 Applications
There are a lot of NXP USA Inc. MC33FS6500NAER2Power Management applications.
- Space satellite point of load supply
- Server Backplane Systems
- LP2996A: DDR1
- Motherboard
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- Wireless routers
- Cluster
- Chromebook
- 4K Ultra High Definition (UHD) Display
- LP2996A: DDR2
