MC33FS6501CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6501CAE Overview
Tray is acceptable as a shipping the power management method.In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method facilitates easy adaptation.Applications targeting this power management include System Basis Chip and others.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .The power management runs on 1V~5V voltage.
MC33FS6501CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6501CAE Applications
There are a lot of NXP USA Inc. MC33FS6501CAEPower Management applications.
- Medical PC
- Set-Top-Box
- Telecommunications Equipment
- Standard notebook PC
- Portable Navigation Devices
- Space satellite point of load supply
- Memory Power
- Wireless routers
- Automotive display
- Networking Router
