MC33FS6501CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6501CAER2 Overview
It is acceptable to ship using the method Tape & Reel (TR) .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.The Surface Mount mounting method facilitates easy adaptation.There are a number of applications targeted at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.For its operation, this power management requires 1V~5V voltage.
MC33FS6501CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6501CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6501CAER2Power Management applications.
- Modules With Remote-Sense Capability
- Chromebook
- Port/cable dongles
- Debug
- System Thermal for PCs
- LP2996A: DDR2
- Standard notebook PC
- Real-time Signal Monitoring
- Netbooks
- Storage Systems
