MC33FS6501NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6501NAE Overview
It is acceptable to ship using the method Tray .To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.At System Basis Chip and other applications, this power management is targeted.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.For its operation, the power management uses 1V~5V voltage.
MC33FS6501NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6501NAE Applications
There are a lot of NXP USA Inc. MC33FS6501NAEPower Management applications.
- System Health Monitoring
- Industrial applications
- Automotive cluster
- Portable Systems
- LP2996A: DDR3L
- SmartPhones
- Real-time Signal Monitoring
- Supplement In-Circuit Tester (ICT) Access
- Wireless routers
- Digital Cores
