MC33FS6501NAER2
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
MC33FS6501NAER2 Overview
Tape & Reel (TR) is acceptable as a shipping the power management method.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.For easy adaptability, Surface Mount provides a universal mounting method.The power management is designed for use with applications at System Basis Chip .The operating temperature of the power management ic should be set to -40°C~125°C to avoid mal-function.The power management works at 1V~5V voltage.
MC33FS6501NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6501NAER2 Applications
There are a lot of NXP USA Inc. MC33FS6501NAER2Power Management applications.
- Industrial applications
- Cluster
- I/Os (FPGAs, ASICs, DSPs)
- Automotive head unit
- Optical imaging payload
- Telecommunication
- FPGA, DSP Core Power
- HSTL Termination
- Automotive display
- Equipment Run-Off of Battery Backup
