MC33FS6502CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6502CAE Overview
Tray is acceptable as a shipping the power management method.A convenient transport package is provided in 48-LQFP Exposed Pad .The Surface Mount mounting method is universal for easy adaptation.Among other applications, this power management targets System Basis Chip .To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .The power management operates at 1V~5V volts.
MC33FS6502CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6502CAE Applications
There are a lot of NXP USA Inc. MC33FS6502CAEPower Management applications.
- System Thermal for PCs
- Electronic Test Equipment
- Automotive cluster
- HSTL Termination
- Tablet PCs
- Digital Signage
- Optical imaging payload
- Isolated DC-DC Modules
- Hardware Monitoring for Servers
- SmartPhones
