MC33FS6502CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6502CAER2 Overview
Tape & Reel (TR) is acceptable for shipping the power management.A convenient transport package is provided in 48-LQFP Exposed Pad .The Surface Mount mounting method allows for easy adaptation.Applications targeting this power management include System Basis Chip and others.Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management operates at 1V~5V volts.
MC33FS6502CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6502CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6502CAER2Power Management applications.
- HSTL Termination
- Hearing Aids
- Medical
- Chromebook
- Applications Processors
- DDR Termination Voltage WHITE SPACE
- System Health Prognostics
- Equipment Run-Off of Battery Backup
- Servers
- Motherboard
