Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
48-LQFP Exposed Pad |
Operating Temperature |
-40°C~125°C |
Packaging |
Tray |
Published |
2017 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
System Basis Chip |
Voltage - Supply |
1V~5V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Telecom IC Type |
INTERFACE CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC33FS6502LAE Overview
It is acceptable to ship in the direction of Tray .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.Surface Mount is a universal mounting method for easy adaptation.This power management targets at System Basis Chip and other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.As a result, this power management is powered by 1V~5V voltage.
MC33FS6502LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6502LAE Applications
There are a lot of NXP USA Inc. MC33FS6502LAEPower Management applications.
- Wireless routers
- Storage Systems
- SSTL-18 Termination
- LP2996A: DDR3
- Termination Voltage
- Desktop PC
- DDR-II Termination Voltage
- Power Supplies
- Chromebook
- Medical