MC33FS6502LAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6502LAER2 Overview
It is acceptable to ship in the way of Tape & Reel (TR) .Packing in 48-LQFP Exposed Pad makes transportation convenient.The Surface Mount mounting method is universal for easy adaptation.It is intended to be used at System Basis Chip as well as for other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.The power management works at 1V~5V voltage.
MC33FS6502LAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6502LAER2 Applications
There are a lot of NXP USA Inc. MC33FS6502LAER2Power Management applications.
- FPGA
- LP2996A: DDR2
- Power Factor Correction
- FPGA
- Electronic Test Equipment
- Networking Equipment
- Peripheral I/O Power
- LP2996A: DDR1
- Electronic Test Instrumentation
- Digital Cores
