MC33FS6502NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6502NAE Overview
Tray is acceptable as a shipping the power management method.For ease of transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.At System Basis Chip and other applications, this power management is targeted.Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management works at 1V~5V voltage.
MC33FS6502NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6502NAE Applications
There are a lot of NXP USA Inc. MC33FS6502NAEPower Management applications.
- Environmental Test
- Modules With Remote-Sense Capability
- Netbooks
- Equipment Run-Off of Battery Backup
- 4K Ultra High Definition (UHD) Display
- Power Supplies
- Real-time Signal Monitoring
- FPGA
- Digital Signage
- Digital Cores
