Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
48-LQFP Exposed Pad |
Operating Temperature |
-40°C~125°C |
Packaging |
Tray |
Published |
2017 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
System Basis Chip |
Voltage - Supply |
1V~5V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Telecom IC Type |
INTERFACE CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC33FS6503CAE Overview
It is acceptable to ship in the way of Tray .Packing in 48-LQFP Exposed Pad makes transportation convenient.For easy adaptability, Surface Mount provides a universal mounting method.At System Basis Chip and other applications, this power management is targeted.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .As a result, this power management is powered by 1V~5V voltage.
MC33FS6503CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6503CAE Applications
There are a lot of NXP USA Inc. MC33FS6503CAEPower Management applications.
- Real-time Signal Monitoring
- Set-Top-Box
- FPGA
- Telecom Rectifiers
- SmartPhones
- Applications Processors
- System Thermal for PCs
- FPGA, DSP Core Power
- Laser TV
- Cordless Phone Base Station