MC33FS6503CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6503CAER2 Overview
Tape & Reel (TR) is an acceptable method of shipping the power management.Packing in 48-LQFP Exposed Pad makes transportation convenient.Surface Mount is a universal mounting method for easy adaptation.There are a number of applications targeted at System Basis Chip .Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management operates at 1V~5V volts.
MC33FS6503CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6503CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6503CAER2Power Management applications.
- Digital Cores
- Electronic Test Instrumentation
- Networking Equipment
- Port/cable adapters
- Portable Systems
- Set-Top-Box
- Telecommunication
- Industrial Equipment
- Debug
- LTE modem
