MC33FS6503NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6503NAE Overview
It is acceptable to ship in the way of Tray .Packing in 48-LQFP Exposed Pad makes transportation convenient.For ease of adaptability, Surface Mount is an universal mounting method.The power management is targeted at System Basis Chip and other applications.Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management runs on 1V~5V voltage.
MC33FS6503NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6503NAE Applications
There are a lot of NXP USA Inc. MC33FS6503NAEPower Management applications.
- Server Backplane Systems
- Radar system ECU
- Electronic Test Equipment
- Industrial applications
- Switches
- Measurement of Point Voltages
- LP2996A: DDR2
- Radar
- DDR Termination Voltage WHITE SPACE
- Power Factor Correction
