MC33FS6503NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6503NAER2 Overview
It is acceptable to ship in the direction of Tape & Reel (TR) .packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.For ease of adaptability, Surface Mount is an universal mounting method.The power management is intended for use at System Basis Chip as well as other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.The power management operates at 1V~5V volts.
MC33FS6503NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6503NAER2 Applications
There are a lot of NXP USA Inc. MC33FS6503NAER2Power Management applications.
- Computing
- Automotive Digital Cluster
- Cluster
- Automotive Infotainment
- Port/cable adapters
- System Health Monitoring
- LP2996A: DDR3
- Networking Equipment
- Industrial PC
- Hearing Aids
