MC33FS6504LAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6504LAE Overview
Ready for shipping the power management in Tray package.To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method allows for easy adaptation.This power management targets at System Basis Chip and other applications.The operating temperature of the power management ic should be set to -40°C~125°C to avoid mal-function.The power management operates at 1V~5V volts.
MC33FS6504LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6504LAE Applications
There are a lot of NXP USA Inc. MC33FS6504LAEPower Management applications.
- Industrial applications
- Optical imaging payload
- Automotive Navigation Systems
- Networking Router
- Port/cable dongles
- SSTL-18 Termination
- Automotive cluster
- Docking station
- Automotive Infotainment
- Networking Equipment
