MC33FS6510CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6510CAE Overview
Tray is acceptable as a shipping the power management method.A convenient transport package is provided in 48-LQFP Exposed Pad .An easy-to-adapt universal mounting system is provided by Surface Mount .It targets applications such as System Basis Chip and others.Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.The power management operates at a voltage of 1V~5V volts.
MC33FS6510CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6510CAE Applications
There are a lot of NXP USA Inc. MC33FS6510CAEPower Management applications.
- LP2996-N: DDR1 Termination Voltage
- Tablet PCs
- Office Electronics
- FPGA
- Radar system ECU
- DSP
- Wireless routers
- Supplement In-Circuit Tester (ICT) Access
- HSTL Termination
- Industrial/ATE
