MC33FS6510CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6510CAER2 Overview
The way of Tape & Reel (TR) is acceptable for shipping the power management.To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .For easy adaptation, Surface Mount is a universal mounting method.It targets applications such as System Basis Chip and others.Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management operates at 1V~5V volts.
MC33FS6510CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6510CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6510CAER2Power Management applications.
- Field Service
- Computing
- Digital Signage
- Server Backplane Systems
- Industrial PC
- Hardware Monitoring for PCs
- Hand-Held Systems
- Industrial/ATE
- I/Os (FPGAs, ASICs, DSPs)
- SmartPhones
