MC33FS6510LAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6510LAE Overview
Tray is acceptable for shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.The Surface Mount mounting method is universal for easy adaptation.Among other applications, this power management targets System Basis Chip .It is recommended that you set the operating temperature of the power management ic to -40°C~125°C in order to prevent malfunctions.The power management works at 1V~5V voltage.
MC33FS6510LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6510LAE Applications
There are a lot of NXP USA Inc. MC33FS6510LAEPower Management applications.
- SSTL-2 WHITE SPACE
- Modules With Remote-Sense Capability
- DDR Termination Voltage WHITE SPACE
- Measurement of Point Voltages
- Telecommunications Equipment
- Hardware Monitoring for PCs
- Camera Power Applications
- Automotive head unit
- Standard notebook PC
- System Health Prognostics
