MC33FS6510LAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6510LAER2 Overview
Using Tape & Reel (TR) as a shipping the power management path is acceptable.The package is conveniently packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.It targets applications such as System Basis Chip and others.A temperature setting of -40°C~125°C is recommended to avoid malfunctions.For its operation, this power management requires 1V~5V voltage.
MC33FS6510LAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6510LAER2 Applications
There are a lot of NXP USA Inc. MC33FS6510LAER2Power Management applications.
- Equipment Run-Off of Battery Backup
- Portable Navigation Devices
- Industrial applications
- Industrial PC
- Surround view system ECU
- Field Service
- Telecommunications Equipment
- System Health Monitoring
- Medical PC
- DDR-II Termination Voltage
