MC33FS6510NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6510NAE Overview
Shipments can be made in the direction of Tray .A convenient transport package is provided in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.It targets applications such as System Basis Chip and others.Ensure that the operating temperature of the power management ic is set to -40°C~125°C in order to prevent malfunctions.The power management works at 1V~5V voltage.
MC33FS6510NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6510NAE Applications
There are a lot of NXP USA Inc. MC33FS6510NAEPower Management applications.
- LP2996A: DDR2
- Memory Power
- Industrial applications
- FPGA
- LP2996A: DDR3
- Cordless Phone Base Station
- Production Test
- Radar system ECU
- Port/cable adapters
- Networking Equipment
