MC33FS6510NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6510NAER2 Overview
Tape & Reel (TR) is acceptable for shipping the power management.A convenient packaging is provided in the form of 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.The power management is targeted at System Basis Chip and other applications.Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.The power management runs on 1V~5V voltage.
MC33FS6510NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6510NAER2 Applications
There are a lot of NXP USA Inc. MC33FS6510NAER2Power Management applications.
- Printers
- Field Service
- WOA
- Radar system ECU
- LP2996A: DDR3L
- Real-time Signal Monitoring
- Docking station
- Power Supplies
- Portable Navigation Devices
- System Thermal for PCs
