MC33FS6511CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6511CAE Overview
Shipments can be made in the direction of Tray .A convenient packaging is provided in the form of 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.It targets applications such as System Basis Chip and others.The operating temperature of the power management ic should be set to -40°C~125°C to avoid mal-function.It works with 1V~5V voltage.
MC33FS6511CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6511CAE Applications
There are a lot of NXP USA Inc. MC33FS6511CAEPower Management applications.
- Memory Power
- Industrial applications
- Industrial Telemetry Applications
- Electronic Test Equipment
- SmartPhones
- Portable Navigation Devices
- 4K Ultra High Definition (UHD) Display
- Optical imaging payload
- Telecom Rectifiers
- Real-time Signal Monitoring
