MC33FS6511NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6511NAE Overview
It is acceptable to ship in the direction of Tray .To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method for easy adaptation.At System Basis Chip and other applications, this power management is targeted.Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.This power management uses 1V~5V voltage for work.
MC33FS6511NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6511NAE Applications
There are a lot of NXP USA Inc. MC33FS6511NAEPower Management applications.
- Electronic Test Instrumentation
- 4K Ultra High Definition (UHD) Display
- Storage Systems
- Automotive display
- Automotive Advanced Driver Assistance System (ADAS)
- LP2996A: DDR3L
- SSTL-3 Termination
- Portable Systems
- Telecommunications Equipment
- FPGA
