MC33FS6511NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6511NAER2 Overview
The way of Tape & Reel (TR) is acceptable for shipping the power management.Packing in 48-LQFP Exposed Pad makes transportation convenient.Surface Mount is a universal mounting method for easy adaptation.The power management is targeted at System Basis Chip and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.For its operation, the power management uses 1V~5V voltage.
MC33FS6511NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6511NAER2 Applications
There are a lot of NXP USA Inc. MC33FS6511NAER2Power Management applications.
- Production Test
- Tablets
- Networking Router
- SSTL-3 Termination
- Communications payload
- Telecom Rectifiers
- DSP
- Digital Cores
- Space satellite point of load supply
- Camera Power Applications
