MC33FS6512CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6512CAE Overview
It is acceptable to ship using the method Tray .It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.For easy adaptation, Surface Mount is a universal mounting method.This power management targets at System Basis Chip and other applications.Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management operates at a voltage of 1V~5V volts.
MC33FS6512CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6512CAE Applications
There are a lot of NXP USA Inc. MC33FS6512CAEPower Management applications.
- LP2996A: DDR3
- Automotive head unit
- Environmental Test
- Portable Navigation Devices
- Industrial PC
- Equipment Run-Off of Battery Backup
- Automotive Navigation Systems
- Power Supplies
- Supplement In-Circuit Tester (ICT) Access
- Medical PC
