MC33FS6512LAE
| Parameters | |
|---|---|
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
MC33FS6512LAE Overview
It is acceptable to ship in the way of Tray .It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.For ease of adaptability, Surface Mount is an universal mounting method.This power management targets at System Basis Chip and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.The power management operates at a voltage of 1V~5V volts.
MC33FS6512LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6512LAE Applications
There are a lot of NXP USA Inc. MC33FS6512LAEPower Management applications.
- Digital Cores
- Printers
- Automotive Navigation Systems
- Servers
- Projection Mapping
- Industrial applications
- Automotive display
- Measurement of Point Voltages
- SSTL-2 Termination
- Equipment Run-Off of Battery Backup
