MC33FS6512LAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6512LAER2 Overview
Tape & Reel (TR) is acceptable as a shipping the power management method.A convenient transport package is provided in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.This power management targets at System Basis Chip and other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.The power management operates at a voltage of 1V~5V volts.
MC33FS6512LAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6512LAER2 Applications
There are a lot of NXP USA Inc. MC33FS6512LAER2Power Management applications.
- System Thermal for Servers
- Tablets
- HSTL Termination
- Power Factor Correction
- Isolated DC-DC Modules
- Automotive Infotainment
- FPGA
- Peripheral I/O Power
- Set-Top-Box
- Applications Processors
