MC33FS6512NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6512NAER2 Overview
The way of Tape & Reel (TR) is acceptable for shipping the power management.A convenient transport package is provided in 48-LQFP Exposed Pad .For ease of adaptability, Surface Mount is an universal mounting method.The power management is targeted at System Basis Chip and other applications.The operating temperature of the power management ic should be set to -40°C~125°C to avoid mal-function.It works with 1V~5V voltage.
MC33FS6512NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6512NAER2 Applications
There are a lot of NXP USA Inc. MC33FS6512NAER2Power Management applications.
- Hardware Monitoring for PCs
- DSP
- FPGA, DSP Core Power
- LP2996A: DDR3
- SSTL-3 Termination
- GPS
- Server Backplane Systems
- Industrial Telemetry Applications
- DDR Termination Voltage WHITE SPACE
- Netbooks
