MC33FS6513CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6513CAE Overview
Shipments can be made in the direction of Tray .Packing in 48-LQFP Exposed Pad makes transportation convenient.Surface Mount is an universal mounting way for easy adapting.The power management is targeted at System Basis Chip and other applications.It is recommended that you set the operating temperature of the power management ic to -40°C~125°C in order to prevent malfunctions.For its operation, the power management uses 1V~5V voltage.
MC33FS6513CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6513CAE Applications
There are a lot of NXP USA Inc. MC33FS6513CAEPower Management applications.
- Tablet PCs
- Medical PC
- FPGA
- Power Supplies
- Cordless Phone Base Station
- Telecom Rectifiers
- Medical
- SmartPhones
- SSTL-3 Termination
- SSTL-3
