MC33FS6513CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6513CAER2 Overview
Tape & Reel (TR) is acceptable for shipping the power management.A convenient packaging is provided in the form of 48-LQFP Exposed Pad .Surface Mount is a universal mounting method for easy adaptation.The power management is targeted at System Basis Chip and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.This power management uses 1V~5V voltage for work.
MC33FS6513CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6513CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6513CAER2Power Management applications.
- Modules With Remote-Sense Capability
- Automotive display
- LP2996A: DDR3
- DSP
- Servers
- SmartPhones
- Data Storage
- FPGA, DSP Core Power
- Tablet PCs
- DDR Termination Voltage WHITE SPACE
