MC33FS6513NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6513NAE Overview
It is acceptable to ship using the method Tray .In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.It targets applications such as System Basis Chip and others.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.For its operation, this power management requires 1V~5V voltage.
MC33FS6513NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6513NAE Applications
There are a lot of NXP USA Inc. MC33FS6513NAEPower Management applications.
- SSTL-3 Termination
- Electronic Measurement Units
- Isolated DC-DC Modules
- Automotive Navigation Systems
- Radar system ECU
- Server Backplane Systems
- Data Storage
- WOA
- DDR-II Termination Voltage
- System Thermal for Servers
