MC33FS6514LAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6514LAE Overview
Tray is an acceptable method of shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.The Surface Mount mounting method facilitates easy adaptation.At System Basis Chip and other applications, this power management is targeted.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.The power management works at 1V~5V voltage.
MC33FS6514LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6514LAE Applications
There are a lot of NXP USA Inc. MC33FS6514LAEPower Management applications.
- FPGA
- Termination Voltage
- LP2996A: DDR3L
- Cordless Phone Base Station
- Communications payload
- Modules With Remote-Sense Capability
- Peripheral I/O Power
- Office Electronics
- Portable Navigation Devices
- Isolated DC-DC Modules
