MC33FS6514LAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6514LAER2 Overview
It is acceptable to ship in the way of Tape & Reel (TR) .To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.The power management is intended for use at System Basis Chip as well as other applications.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .The power management operates at a voltage of 1V~5V volts.
MC33FS6514LAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6514LAER2 Applications
There are a lot of NXP USA Inc. MC33FS6514LAER2Power Management applications.
- Switches
- Hardware Monitoring for Servers
- Industrial Telemetry Applications
- Networking Equipment
- Medical PC
- Automotive camera module
- Cordless Phone Base Station
- Industrial applications
- GPS
- Automotive Infotainment
