MC33FS6520CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6520CAE Overview
It is acceptable to ship in the direction of Tray .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.For ease of adaptability, Surface Mount is an universal mounting method.The power management is targeted at System Basis Chip and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.The power management runs on 1V~5V voltage.
MC33FS6520CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6520CAE Applications
There are a lot of NXP USA Inc. MC33FS6520CAEPower Management applications.
- Memory Power
- FPGA
- Digital Signage
- Tablet PCs
- Automotive Digital Cluster
- Set-Top-Box
- Termination Voltage
- Production Test
- Hearing Aids
- Equipment Run-Off of Battery Backup
