MC33FS6520LAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6520LAE Overview
Tray is acceptable as a shipping the power management method.Packing in 48-LQFP Exposed Pad makes transportation convenient.For easy adaptability, Surface Mount provides a universal mounting method.It targets applications such as System Basis Chip and others.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.For its operation, the power management uses 1V~5V voltage.
MC33FS6520LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6520LAE Applications
There are a lot of NXP USA Inc. MC33FS6520LAEPower Management applications.
- DSP
- Storage Systems
- Networking Router
- Equipment Run-Off of Battery Backup
- Medical
- Power Supplies
- Power Factor Correction
- Cordless Phone Base Station
- Telecommunication
- Communications payload
