MC33FS6520LAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6520LAER2 Overview
Using Tape & Reel (TR) as a shipping the power management path is acceptable.packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.The Surface Mount mounting method facilitates easy adaptation.The power management is designed for use with applications at System Basis Chip .Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.As a result, this power management is powered by 1V~5V voltage.
MC33FS6520LAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6520LAER2 Applications
There are a lot of NXP USA Inc. MC33FS6520LAER2Power Management applications.
- Digital Cores
- DDR-II Termination Voltage
- Measurement of Point Voltages
- LP2996A: DDR3
- Modules With Remote-Sense Capability
- Automotive display
- Projection Mapping
- Portable Systems
- SmartPhones
- Cordless Phone Base Station
