MC33FS6520NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6520NAE Overview
It is acceptable to ship in the way of Tray .To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.The power management is designed for use with applications at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.As a result, this power management is powered by 1V~5V voltage.
MC33FS6520NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6520NAE Applications
There are a lot of NXP USA Inc. MC33FS6520NAEPower Management applications.
- System Thermal for PCs
- Real-time Signal Monitoring
- Communications payload
- Applications Processors
- Industrial Equipment
- LTE modem
- Field Service
- Industrial applications
- System Health Prognostics
- Storage Systems
