MC33FS6521NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6521NAE Overview
Using Tray as a shipping the power management path is acceptable.To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .For ease of adaptability, Surface Mount is an universal mounting method.At System Basis Chip and other applications, this power management is targeted.Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management operates at 1V~5V volts.
MC33FS6521NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6521NAE Applications
There are a lot of NXP USA Inc. MC33FS6521NAEPower Management applications.
- Power Factor Correction
- Real-time Signal Monitoring
- SSTL-18 Termination
- Medical PC
- System Thermal for Servers
- Automotive Advanced Driver Assistance System (ADAS)
- Termination Voltage
- LP2996A: DDR1
- System Health Monitoring
- DDR2 Termination Voltage
