MC33FS6522CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6522CAE Overview
Tray is acceptable as a shipping the power management method.To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.There are a number of applications targeted at System Basis Chip .Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.For its operation, this power management requires 1V~5V voltage.
MC33FS6522CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6522CAE Applications
There are a lot of NXP USA Inc. MC33FS6522CAEPower Management applications.
- Automotive cluster
- System Thermal for Servers
- Power Supplies
- Measurement of Point Voltages
- Industrial applications
- Server Backplane Systems
- Docking station
- System Health Monitoring
- Hearing Aids
- Desktop PC
