MC33FS6522CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6522CAER2 Overview
Tape & Reel (TR) is acceptable as a shipping the power management method.A convenient transport package is provided in 48-LQFP Exposed Pad .Surface Mount is an universal mounting way for easy adapting.Among other applications, this power management targets System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.The power management operates at a voltage of 1V~5V volts.
MC33FS6522CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6522CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6522CAER2Power Management applications.
- Netbooks
- FPGA, DSP Core Power
- Portable Navigation Devices
- Automotive Advanced Driver Assistance System (ADAS)
- Telecommunications Equipment
- Automotive display
- Automotive Infotainment
- SSTL-3 Termination
- Set-Top-Box
- Laser TV
