MC33FS6522LAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6522LAER2 Overview
Tape & Reel (TR) is acceptable for shipping the power management.A convenient packaging is provided in the form of 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.The power management is designed for use with applications at System Basis Chip .A temperature setting of -40°C~125°C is recommended to avoid malfunctions.The power management operates at a voltage of 1V~5V volts.
MC33FS6522LAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6522LAER2 Applications
There are a lot of NXP USA Inc. MC33FS6522LAER2Power Management applications.
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- Automotive display
- Portable Media Players
- Networking Router
- Automotive camera module
- System Health Monitoring
- Switches
- Environmental Test
- Automotive Navigation Systems
- Port/cable dongles
