Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
48-LQFP Exposed Pad |
Operating Temperature |
-40°C~125°C |
Packaging |
Tray |
Published |
2017 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
System Basis Chip |
Voltage - Supply |
1V~5V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Telecom IC Type |
INTERFACE CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC33FS6522NAE Overview
Ready for shipping the power management in Tray package.packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.Surface Mount is a universal mounting method for easy adaptation.The power management is targeted at System Basis Chip and other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.This power management uses 1V~5V voltage for work.
MC33FS6522NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6522NAE Applications
There are a lot of NXP USA Inc. MC33FS6522NAEPower Management applications.
- Data Storage
- Automotive Advanced Driver Assistance System (ADAS)
- System Thermal for PCs
- LP2996A: DDR3
- Field Service
- Supplement In-Circuit Tester (ICT) Access
- Optical imaging payload
- Portable Media Players
- Port/cable dongles
- Industrial PC