MC33FS6523CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6523CAE Overview
The way of Tray is acceptable for shipping the power management.packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.Surface Mount is a universal mounting method that is easy to adapt.The power management is targeted at System Basis Chip and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.The power management operates at 1V~5V volts.
MC33FS6523CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6523CAE Applications
There are a lot of NXP USA Inc. MC33FS6523CAEPower Management applications.
- Chromebook
- LTE modem
- Printers
- FPGA
- Port/cable adapters
- Communications payload
- Production Test
- Hand-Held Systems
- Standard notebook PC
- Modules With Remote-Sense Capability
