MC33FS6523CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6523CAER2 Overview
It is acceptable to ship in the way of Tape & Reel (TR) .The package is conveniently packaged the power management in 48-LQFP Exposed Pad .For ease of adaptability, Surface Mount is an universal mounting method.Among other applications, this power management targets System Basis Chip .Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.It works with 1V~5V voltage.
MC33FS6523CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6523CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6523CAER2Power Management applications.
- Electronic Test Instrumentation
- Office Electronics
- System Thermal for Servers
- Tablet PCs
- LP2996A: DDR2
- Server Backplane Systems
- Tablets
- Automotive camera module
- Automotive Infotainment
- SmartPhones
