MC33PF8100CCES
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33PF8100CCES Overview
The way of Tray is acceptable for shipping the power management.A convenient packaging is provided in the form of 56-VFQFN Exposed Pad .An easy-to-adapt universal mounting system is provided by Surface Mount, Wettable Flank .It is intended to be used at High Performance i.MX 8, S32x Processor Based as well as for other applications.Ensure that the operating temperature of the power management ic is set to -40°C~105°C TA in order to prevent malfunctions.For its operation, this power management requires 2.5V~5.5V voltage.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC33PF8100CCES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8100CCES Applications
There are a lot of NXP USA Inc. MC33PF8100CCESPower Management applications.
- HSTL Termination
- Cluster
- Telecom Rectifiers
- Debug
- Servers
- LP2996A: DDR1
- SmartPhones
- LTE modem
- Field Service
- Industrial Telemetry Applications
