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MC33PF8100CDES

2.5V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MC33PF8100CDES
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: -
  • Stock: 432
  • Description: 2.5V~5.5V Specialized Power Management ICs(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V

MC33PF8100CDES Overview


Ready for shipping the power management in Tray package.packaged the power management in 56-VFQFN Exposed Pad for ease of transportation, it is easy to transport.Surface Mount, Wettable Flank is a universal mounting method for easy adaptation.Applications targeting this power management include High Performance i.MX 8, S32x Processor Based and others.It is recommended that the operating temperature of the power management ic be set to -40°C~105°C TA in order to prevent malfunction.The power management runs on 2.5V~5.5V voltage.

MC33PF8100CDES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA

MC33PF8100CDES Applications


There are a lot of NXP USA Inc. MC33PF8100CDESPower Management applications.

  • WOA
  • FPGA
  • Portable Navigation Devices
  • Optical imaging payload
  • LP2996A: DDR3L
  • Automotive Navigation Systems
  • DDR2 Termination Voltage
  • 4K Ultra High Definition (UHD) Display
  • Networking Equipment
  • Radar

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